HP40合金表面原位制備復合氧化層In-situ preparation of compound oxidation scales on HP40 alloy

采用原位氧化法于H₂和水蒸汽形成的低氧分壓環(huán)境中，在HP40合金表面制備復合氧化膜。用XRD、EDS和SEM分別表征合金表面氧化膜的物相、成分、形貌，以及在氧化層截面上各組元的線和面分布狀態(tài)。結果表明，隨著制備溫度的升高，合金表面MnCr₂O₄尖晶石逐漸增加，其形貌由針狀逐漸變?yōu)轭w粒狀，顆粒尺寸小于1 μm；氧化膜的總厚度為7 μm，由外向內(nèi)分別為MnCr₂O₄尖晶石、Cr₂O₃和SiO₂ 3層。

Compound oxide scales were in-situ prepared on the surface of HP40 alloy in the H₂/steam atmosphere with low oxygen partial pressure at 900?1 200 ℃. Then, the oxide scales on HP40 alloy were characterized by SEM, EDS and XRD. The results show that the quantity of MnCr₂O₄ spinel of the scale increases with the heat treating temperature increasing, while the morphologies of the scale change from acicular to granulate. The size of spinel granules on the surface is smaller than 1 μm. The total thickness of the formed oxide scales is about 7 μm, which can be characterized as three layers, i.e., the outer MnCr₂O₄ spinel layer, the middle Cr₂O₃ rich layer, and the most inner SiO₂ layer, respectively.

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